Freescale Semiconductor, Inc.
Mechanical Specifications
28-Pin Plastic Dual In-Line Package (Case 710)
16.5 28-Pin Pla stic Dua l In-Line Pa c ka g e (Ca se 710)
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
28
1
15
14
2. DIMENSION
WHEN FORMED PARALLEL.
3. DIMENSION DOES NOT INCLUDE
MOLD FLASH.
L
TO CENTER OF LEADS
B
B
MILLIMETERS
MIN MAX
INCHES
MIN MAX
DIM
A
B
C
D
F
36.45 37.21
13.72 14.22
1.435 1.465
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
L
A
C
3.94
0.36
1.02
5.08
0.56
1.52
N
G
H
J
2.54 BSC
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
1.65
0.20
2.92
2.16
0.38
3.43
J
H
G
K
L
M
K
SEATING
PLANE
15.24 BSC
0.600 BSC
F
D
0°
0.51
15°
1.02
0°
0.020 0.040
15°
M
N
16.6 28-Pin Sm a ll Outline Inte g ra te d Circ uit (Ca se 751F)
-A-
NOTES:
28
1
15
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION
PROTRUSION.
14X P
M
-B-
0.010 (0.25M)
B
A
AND
B
DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
14
5. DIMENSION
D
DOES NOT INCLUDE
DAMBAR PROTRUSIONA. LLOWABLE
28X D
DAMBAR PROTRUSION SHALL BE 0.13
D
(0.005) TOTAL IN EXCESS OF
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
0.010 (0.25M)
T
S
A
S
B
R X 45°
MILLIMETERS
MIN MAX
17.80 18.05
INCHES
MIN MAX
C
DIM
A
-T-
0.701 0.711
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
-T-
SEATING
PLANE
B
7.40
2.35
0.35
0.41
7.60
2.65
0.49
0.90
26X G
C
D
K
F
F
G
J
1.27 BSC
0.23
0.13
0.32
0.29
8°
0.009 0.013
0.005 0.011
J
K
M
P
0°
0°
0.395 0.415
8°
10.05 10.55
0.25 0.75
R
0.010 0.029
MC68HC705JJ7/MC68HC705JP7 — Rev. 2.0
Mechanical Specifications
General Release Specification
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