Freescale Semiconductor, Inc.
Me c ha nic a l Sp e c ific a tions
16.7 20-Pin Wind owe d Ce ra m ic Inte g ra te d Circ uit (Ca se 732)
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
20
1
11
10
3. DIMENSIONS A AND B INCLUDE MENISCUS.
B
C
INCHES
A
DIM MIN
MAX
A
B
C
D
F
G
H
J
K
L
M
N
0.940 0.990
0.260 0.295
0.150 0.200
0.015 0.022
0.055 0.065
0.100 BSC
0.020 0.050
0.008 0.012
0.125 0.160
0.300 BSC
L
F
N
J
H
K
M
G
0
15
D
0.010 0.040
SEATING
PLANE
16.8 28-Pin Wind owe d Ce ra m ic Inte g ra te d Circ uit (Ca se 733A)
NOTES:
28
15
14
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION
4. DIMENSION
B
A
L
AND
B
TO CENTER OF LEADS WHEN
INCLUDE MENISCUS.
1
FORMED PARALLEL.
INCHES
MILLIMETERS
M
J
–A–
DIM MIN
MAX
1.490
0.605
0.240
0.022
0.065
MIN
36.45
12.70
4.06
MAX
37.84
15.36
6.09
L
A
B
C
D
F
1.435
0.500
0.160
0.015
0.050
0.38
1.27
0.55
1.65
N
C
G
J
0.100 BSC
2.54 BSC
–T–
SEATING
PLANE
0.008
0.125
0.012
0.160
0.20
3.17
0.30
4.06
K
K
L
0.600 BSC
15.24 BSC
G
M
N
0
0.020
15
0.050
0
_
0.51
15
_
1.27
_
_
F
D 28 PL
M
M
0.25 (0.010)
T A
General Release Specification
MC68HC705JJ7/MC68HC705JP7 — Rev. 2.0
Mechanical Specifications
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