Part 4 Packaging
4.1 Package and Pin-Out Information 56F807
This section contains package and pin-out information for the 56F807. This device comes in two case
types: low-profile quad flat pack (LQFP) or mold array process ball grid assembly (MAPBGA).
Figure 4-1 shows the package outline for the LQFP case, Figure 4-2 shows the mechanical parameters
for the LQFP case, and Table 4-1 lists the pinout for the LQFP case. Figure 4-3 shows the mechanical
parameters for the MAPBGA case, and Table 4-2 lists the pinout for the MAPBGA package.
Orientation Mark
A0
ANB7
A1
A2
A3
A4
A5
ANB6
ANB5
ANB4
ANB3
121
Pin 1
ANB2
A6
A7
ANB1
ANB0
V
V
DD
A8
SSA
V
V
DDA
A9
REF2
A10
ANA7
A11
A12
ANA6
ANA5
A13
A14
ANA4
ANA3
A15
ANA2
ANA1
ANA0
V
SS
PS
DS
WR
RD
D0
V
SSA
V
V
DDA
REF
RESET
RSTO
D1
V
D2
D3
DD
V
V
SS
DD
D4
D5
EXTAL
XTAL
D6
D7
V
V
SS
D8
SS
D9
V
V
V
DD
D10
DDA
V
DD
SSA
D11
D12
D13
EXTBOOT
FAULTA3
FAULTA2
D14
D15
81
FAULTA1
FAULTA0
PWMA5
41
GPIOB0
Figure 4-1 Top View, 56F807 160-pin LQFP Package
56F807 Technical Data Technical Data, Rev. 16
48
Freescale Semiconductor
FREESCALE [ Freescale ]
