D
X
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
Y
M
K
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
E
5. PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
MILLIMETERS
DIM MIN MAX
0.20
A
A1
A2
b
1.32
0.27
1.18 REF
1.75
0.47
0.35
0.65
13X
e
D
E
e
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
S
METALIZED MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
S
14 13 12 11 10
9
6
5
4
3
2
1
A
B
C
D
E
F
5
S
0.30 Z
A2
13X
e
A
G
H
J
160X
A1
0.15 Z
4
Z
K
L
M
DETAIL K
ROTATED 90 CLOCKWISE
°
N
P
3
160X
b
0.30 Z X Y
0.10 Z
VIEW M-M
CASE 1268-01
ISSUE O
Figure 4-3 160 MAPBGA Mechanical Information
Please see www.freescale.com for the most current case outline.
56F807 Technical Data Technical Data, Rev. 16
52
Freescale Semiconductor
FREESCALE [ Freescale ]
