General Characteristics
Table 10-4 Recommended Operating Conditions
(V
= 0V, V
= 0V, V = 0V )
REFL
SSA
SS
Characteristic
Supply voltage
Symbol
VDD
Notes
Min
3
Typ
3.3
3.3
—
0
Max
3.6
Unit
V
ADC Supply voltage
VDDA
3
3.6
V
ADC High Voltage Reference
Voltage difference VDD_IO to VDDA
Voltage difference VSS_IO to VSSA
VREFH
ΔVDD
3
VDDA
0.1
V
-0.1
-0.1
V
ΔVSS
0
0.1
V
Device Clock Frequency
Using relaxation oscillator
Using external clock source
FSYSCLK
—
MHz
8
0
32
32
Input Voltage High (digital inputs)
Input Voltage Low (digital inputs)
Output Source Current High (at VOH min.)
VIH
VIL
IOH
Pin Groups 1, 2
Pin Groups 1, 2
2
—
—
5.5
0.8
V
V
-0.3
mA
Pin Group 1
Pin Group 1
—
—
—
—
-4
-8
When programmed for low drive strength
When programmed for high drive strength
Output Source Current Low (at VOL max.)
IOL
mA
Pin Groups 1, 2
Pin Groups 1, 2
—
—
—
—
4
8
When programmed for low drive strength
When programmed for high drive strength
Ambient Operating Temperature
TA
NF
-40
—
—
105
—
°C
Flash Endurance
(Program Erase Cycles)
TA = -40°C to
105°C
10,000
Cycles
Flash Data Retention
TR
TJ <= 85°C avg
TJ <= 85°C avg
15
20
—
—
—
—
Years
Years
Flash Data Retention with <100
Program/Erase Cycles
tFLRET
Note: Total chip source or sink current cannot exceed 50mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC analog inputs
56F8014 Technical Data, Rev. 9
Freescale Semiconductor
Preliminary
93