PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
• Convection: 225°C +5.0/-0°C
SOLDERING INFORMATION
• Vapor Phase Reflow (VPR): 215°C to 219°C
• Infrared (IR)/Convection: 225°C +5.0/-0°C
The 33982 is packaged in a surface mount power package
intended to be soldered directly on the printed circuit board.
The maximum peak temperature during the soldering
process should not exceed 230°C. The time at maximum
temperature should range from 10 to 40 s maximum.
The 33982 was qualified in accordance with JEDEC
standards JESD22-A113-B and J-STD-020A. The
recommended reflow conditions are as follows:
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
FREESCALE [ Freescale ]
