ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
Transparent Top View
A
12 11 10
9
8
7
6
5
4
3
2
1
13
GND
A
14
VPWR
15
HS
16
HS
33982 Pin Connections
16-Pin PQFN
0.90 mm Pitch
12.0 mm x 12.0 mm Body
Figure 14. Thermal Test Board
Table 20. Thermal Resistance Performance
Device on Thermal Test Board
1 = Power Chip, 2 = Logic Chip (°C/W)
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Area A
(mm2)
Thermal
Resistance
m = 1,
n = 1
m = 1, n = 2
m = 2, n = 1
m = 2,
n = 2
Cu traces, 0.07 mm thickness
0
55
41
39
42
32
29
74
66
65
Outline:
Area A:
80 mm x 100 mm board area,
including edge connector for thermal
testing
300
600
R
θJAmn
Cu heat-spreading areas on board
surface
RθJA is the thermal resistance between die junction and
ambient air.
Ambient Conditions: Natural convection, still air
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
33982
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
FREESCALE [ Freescale ]
