ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to V
SS
unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
ESD Voltage
Human Body Model - HBM (All pins except for the pins listed below)
Pins: PA_Boot, PA_HS_S, PA_HS_G, PB_Boot, PB_HS_S, PB_HS_G,
PC_Boot, PC_HS_S, PC_HS_G, VPWR
Charge Device Model - CDM
Corner pins
All other pins
THERMAL RATINGS
Storage Temperature
Operating Junction Temperature
Thermal Resistance
(7)
Junction-to-Case
Soldering Temperature
(8)
R
θJC
T
SOLDER
3.0
Note 9
°C
T
STG
T
J
-55 to +150
-40 to +150
°C
°C
°C/W
±750
±300
Symbol
V
ESD
±2000
±1000
Value
Unit
V
Notes
6. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω)
and the Charge Device
Model (CDM), Robotic (C
ZAP
= 4.0 pF).
7.
Case is considered EP - pin 55 under the body of the device. The actual power dissipation of the device is dependent on the operating
mode, the heat transfer characteristics of the board and layout and the operating voltage. See
and
for examples of
power dissipation profiles of two common configurations. Operation above the maximum operating junction temperature will result in a
reduction in reliability leading to malfunction or permanent damage to the device.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8.
9.
33937
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
