ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to VSS unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings
Symbol
Value
Unit
ESD Voltage(6)
VESD
V
Human Body Model - HBM (All pins except for the pins listed below)
Pins: PA_Boot, PA_HS_S, PA_HS_G, PB_Boot, PB_HS_S, PB_HS_G,
PC_Boot, PC_HS_S, PC_HS_G, VPWR
±2000
±1000
Charge Device Model - CDM
Corner pins
±750
±300
All other pins
THERMAL RATINGS
Storage Temperature
TSTG
TJ
-55 to +150
-40 to +150
°C
°C
Operating Junction Temperature
Thermal Resistance(7)
Junction-to-Case
°C/W
RθJC
3.0
Soldering Temperature(8)
TSOLDER
Note 9
°C
Notes
6. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device
Model (CDM), Robotic (CZAP = 4.0 pF).
7. Case is considered EP - pin 55 under the body of the device. The actual power dissipation of the device is dependent on the operating
mode, the heat transfer characteristics of the board and layout and the operating voltage. See Figure 24 and Figure 25 for examples of
power dissipation profiles of two common configurations. Operation above the maximum operating junction temperature will result in a
reduction in reliability leading to malfunction or permanent damage to the device.
8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33937
Analog Integrated Circuit Device Data
Freescale Semiconductor
8
FREESCALE [ Freescale ]
