ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
65
60
55
50
45
40
35
30
25
0
100
200
300
400
500
600
R
R
R
R
RJA22
θJA22
RJA11
RJA12=RJA21
θJA21
θJA11
θJA12=
Figure 12. Steady State Thermal Resistance1W step response;
device on 1s thermal test board with heat spreading areas sq 600mm.
100
10
1
0.1
1.00E-06
1.00E-04
1.00E-02
1.00E+00
1.00E+02
1.00E+04
R
RJA12=RJA21
θJA12=
R
RJA22
θJA22
R
R
θJRA1J1A11
θJA21
Figure 13. Transient Thermal Resistance
33874
Analog Integrated Circuit Device Data
Freescale Semiconductor
36