ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Transparent Top View
76.2 mm
13 12 11 10
9
8
7
6
5
4
3
2
1
SO
16
17
24
FSI
14
GND
GND
23
GND
22
HS2
HS3
18
A =
A =
300sqmm
300sqmm
15
VPWR
19
20
21
HS0
HS1
NC
MC33874 Pin Connections
24-Pin PQFN (12 x 12)
0.9 mm Pitch
12.0 mm x 12.0 mm Body
Figure 11. Thermal Test Board
Table 19. Thermal Resistance Performance
Device on Thermal Test Board
Material:
Single layer printed circuit board
1 = Power Chip, 2 = Logic Chip (°C/W)
Area A
(mm2)
Thermal
Resistance
FR4, 1.6mm thickness
m = 1,
n = 1
m = 1, n = 2
m = 2, n = 1
m = 2,
n = 2
Cu traces, 0.07mm thickness
0
53
44
42
38
32
30
61
56
55
Outline:
80mm x 100mm board area,
including edge connector for thermal
testing
300
600
R
θJAmn
Area A:
Cu heat-spreading areas on board
surface
RθJA is the thermal resistance between die junction and
ambient air.
Ambient Conditions: Natural convection, still air
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
33874
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
FREESCALE [ Freescale ]
