PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
The 33874 is packaged in a surface mount power package
Sn-Pb soldering profile and JESD22-B102D as for
intended to be soldered directly on the printed circuit board.
solderability test, with reflow conditions as follows:
The 33874 was qualified in accordance with JEDEC
Reflow Soldering: 215°C+/-5°C
standards JESD22-A113-B, J-STD-020A with MSL3/245°C
Wave Soldering: 245°C +/-5°C
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ART10510D listed below.
PNA SUFFIX (PB-FREE)
24-PIN PQFN
NONLEADED PACKAGE
98ART10510D
ISSUE O
33874
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
FREESCALE [ Freescale ]
