ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 4. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Operating Temperature
Ambient
°C
TA
TJ
-40 to 125
-40 to 150
Junction
Storage Temperature
Thermal Resistance
TSTG
-55 to 165
20
°C
RθJG
RTJC-RθJC
PD
°C/W
°C/W
Thermal Resistance Junction Case (QFN)
Power Dissipation (4)
TBD
1.0
W
(7)
Peak Package Reflow Temperature During Reflow (6)
,
TPPRT
Note 7
°C
Notes
4. Maximum power dissipation is at 85°C ambient temperature in free aIr and with no heatsink, according to JEDEC JESD51-2 and
JESD51-3 specifications.
5. The package is not designed for immersion soldering. The maximum soldering time is 10 seconds at 240 °C on any pin. Exceeding the
maximum temperature and time limits may cause permanent damage to the device.
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33742
CANH
33742
1.0 nF
1.0 nF
Transient Pulse
Generator
(Note)
Transient Pulse
Generator
(Note)
1.0 nF
Lx
CANL
GND
10 kΩ
GND
GND
GND
Note Waveform per ISO 7637-1. Test Pulses 1, 2, 3a, and 3b.
Note Waveform per ISO 7637-1. Test Pulses 1, 2, 3a, and 3b.
Figure 6. Transient Test Setup for CANH/CANL
Figure 5. Transient Test Setup for L0:L3 Inputs
33742
Analog Integrated Circuit Device Data
Freescale Semiconductor
8