Power Characteristics
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3
4
5
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Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
Thermal solutions may need to design to a value higher than typical power based on the end application, TA target, and I/O
power.
Maximum power is based on a voltage of VDD = 1.2 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
Maximum power is based on a voltage of VDD = 1.3 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
Table 5 shows the estimated typical I/O power dissipation for MPC8349EA.
Table 5. MPC8349EA Typical I/O Power Dissipation
GVDD
(1.8 V)
GVDD
(2.5 V)
OVDD
(3.3 V)
LVDD
(3.3 V)
LVDD
(2.5 V)
Interface
DDR I/O
65% utilization
2.5 V
Rs = 20 Ω
Rt = 50 Ω
2 pair of clocks
Parameter
Unit
Comments
200 MHz, 32 bits
200 MHz, 64 bits
266 MHz, 32 bits
266 MHz, 64 bits
300 MHz, 32 bits
300 MHz, 64 bits
333 MHz, 32 bits
333 MHz, 64 bits
400 MHz, 32 bits
400 MHz, 64 bits
33 MHz, 64 bits
66 MHz, 64 bits
33 MHz, 32 bits
66 MHz, 32 bits
133 MHz, 32 bits
83 MHz, 32 bits
66 MHz, 32 bits
50 MHz, 32 bits
MII
0.31
0.42
0.35
0.47
0.37
0.50
0.39
0.53
0.44
0.59
—
0.42
0.55
0.5
0.66
0.54
0.7
0.58
0.76
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.01
0.06
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.04
—
—
—
W
W
W
W
W
W
W
W
—
—
W
W
W
W
W
W
W
W
W
W
W
W
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
PCI I/O
load = 30 pF
—
0.08
0.14
0.04
0.07
0.27
0.17
0.14
0.11
—
—
—
—
—
Multiply by 2 if using
2 ports.
—
—
Local bus I/O
load = 25 pF
—
—
—
—
—
—
—
—
—
—
—
—
TSEC I/O
load = 25 pF
—
—
Multiply by number of
interfaces used.
GMII or TBI
—
—
—
RGMII or RTBI
12 MHz
—
—
—
USB
—
—
0.01
0.2
0.01
Multiply by 2 if using
2 ports.
480 MHz
—
—
Other I/O
—
—
—
—
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
11