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EMD3D256M08G1-150CBS1 参数 Datasheet PDF下载

EMD3D256M08G1-150CBS1图片预览
型号: EMD3D256M08G1-150CBS1
PDF下载: 下载PDF文件 查看货源
内容描述: [256Mb ST-DDR3 Spin-transfer Torque MRAM]
分类和应用: 双倍数据速率
文件页数/大小: 38 页 / 2405 K
品牌: EVERSPIN [ Everspin Technologies ]
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EMD3D256M08BS1  
EMD3D256M16BS1  
BALL FUNCTIONS AND DESCRIPTIONS  
Table 4 – Ball Functions and Descriptions  
Symbol  
Type  
Name  
Description  
Clock: CK and CK are differential clock inputs. All control and address input signals  
are sampled on the crossing of the positive edge of CK and the negative edge of CK.  
Output data strobe (DQS, DQS) is referenced to the crossings of CK and CK.  
CK, CK  
Input  
Clock  
Clock enable: CKE enables (registered HIGH) and disables (registered LOW) internal  
circuitry and clocks on the STT-MRAM. The specific circuitry that is enabled/ dis-  
abled is dependent upon the DDR3 STT-MRAM configuration and operating mode.  
CKE  
Input  
Clock Enable Taking CKE LOW provides PRECHARGE POWER-DOWN, or active power-down (row  
active in any bank). CKE is synchronous for power-down entry and exit. Input buf-  
fers (excluding CK, CK, CKE, RESET, and ODT) are disabled during POWER-DOWN.  
CKE is referenced to V  
.
REFCA  
Chip Select: All commands are masked when CS is registered HIGH. CS provides for  
CS  
Input  
Input  
Chip Select  
external Rank selection on systems with multiple Ranks. CS is considered part of  
the command code.  
On Die Termination: ODT (registered HIGH) enables termination resistance internal  
to the DDR3 STT-MRAM. When enabled, ODT is only applied to each DQ, DQS, DQS  
and DM/TDQS, NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1)  
signal for x8 configurations. The ODT pin will be ignored if MR1 is programmed to  
disable ODT.  
On-Die Termi-  
nation  
ODT  
Command  
Inputs  
Command Inputs: RAS, CAS and WE (along with CS) define the command being  
entered.  
RAS, CAS, WE Input  
Input Data Mask: DM is an input mask signal for write data. Input data is masked  
when DM is sampled HIGH coincident with that input data during a WRITE access.  
DM is sampled on both edges of DQS. For x8 device, the function of DM or TDQS/  
TDQS is enabled by Mode Register A11 setting in MR1. For x16 DML is associated  
with DQ0-7 while DMU is associated with DQ8-15.  
Input Data  
Mask  
DM  
Input  
Bank address inputs: BA[2:0] define the bank to which an ACTIVE, READ, WRITE, or  
Bank Address PRECHARGE command is being applied. BA[2:0] define which mode register (MR0,  
BA0, BA1, BA2 Input  
Inputs  
MR1, MR2, or MR3) is loaded during the LOAD MODE command. BA[2:0] are refer-  
enced to V  
.
REFCA  
Address Inputs: Provide the row address for Active commands and the column  
address for READ/WRITE commands to select one location out of the memory array  
in the respective bank. (A10/AP and A12/BC have additional functions, see below).  
The address inputs also provide the op-code during Mode Register Set commands.  
In using the device in x16 mode A15 needs to be pulled to logic HIGH.  
Address  
Inputs  
A0-A15  
Input  
Table continues on the next page.  
EMD3D256M08BS1/16BS1 Revision 1.3 10/2018  
Copyright © 2018 Everspin Technologies  
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