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M11L416256SA-40T 参数 Datasheet PDF下载

M11L416256SA-40T图片预览
型号: M11L416256SA-40T
PDF下载: 下载PDF文件 查看货源
内容描述: [EDO DRAM, 256KX16, 40ns, CMOS, PDSO40, TSOP2-44/40]
分类和应用: 动态存储器光电二极管内存集成电路
文件页数/大小: 16 页 / 230 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
 浏览型号M11L416256SA-40T的Datasheet PDF文件第1页浏览型号M11L416256SA-40T的Datasheet PDF文件第2页浏览型号M11L416256SA-40T的Datasheet PDF文件第3页浏览型号M11L416256SA-40T的Datasheet PDF文件第4页浏览型号M11L416256SA-40T的Datasheet PDF文件第6页浏览型号M11L416256SA-40T的Datasheet PDF文件第7页浏览型号M11L416256SA-40T的Datasheet PDF文件第8页浏览型号M11L416256SA-40T的Datasheet PDF文件第9页  
M11L416256A/M11L416256SA  
(Continued)  
-25  
-28  
-30  
-35  
-40  
PARAMETER  
SYMBOL  
UNIT NOTES  
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX  
RCH  
RRH  
ns  
t
t
0
0
3
0
0
3
Read Command Hold Time Reference to  
Read Command Hold Time Reference to  
0
0
3
0
0
3
0
0
3
9,15,19  
CAS  
RAS  
ns  
ns  
9
CLZ  
20  
t
to Output in Low-Z  
CAS  
Output Buffer Turn-off Delay From  
RAS  
or  
CAS  
OFF1  
3
15  
6
3
15  
7
ns  
ns  
t
3
15  
8
3
15  
8
3
15  
8
10,17,20  
17,26  
OFF2  
t
t
t
t
Output Buffer Turn-off to  
OE  
Write Command Setup Time  
Write Command Hold Time  
WCS  
WCH  
WCR  
WP  
ns  
ns  
ns  
ns  
11,15,18  
15,25  
15  
0
5
0
5
0
5
0
5
0
5
22  
24  
Write Command Hold Time(Reference to  
Write Command Pulse Width  
)
26  
30  
34  
RAS  
15  
t
5
7
5
7
5
8
6
5
9
7
5
10  
8
RWL  
ns  
15  
t
t
Write Command to  
Lead Time  
Lead Time  
RAS  
CAS  
CWL  
ns  
ns  
ns  
15,19  
12,20  
12,20  
5
0
5
0
Write Command to  
Data-in Setup Time  
Data-in Hold Time  
DS  
DH  
t
0
5
0
5
0
5
t
5
5
DHR  
ns  
ns  
ns  
ns  
t
22  
24  
Data-in Hold Time (Reference to  
)
26  
30  
34  
RAS  
RWD  
34  
21  
17  
38  
25  
19  
11  
11  
t
t
t
to  
Delay Time  
WE  
46  
31  
25  
51  
34  
26  
56  
36  
27  
RAS  
AWD  
CWD  
Column Address to  
Delay Time  
WE  
11,18  
2,3  
to  
Delay Time  
WE  
CAS  
Transition Time (rise or fall)  
Refresh Period (512 cycles)  
T
ns  
ms  
ms  
t
1.5 50 1.5 50  
1.5 50 2.5 50 2.5 50  
REF  
REF  
t
8
8
8
8
8
Refresh Period (512 cycles) Self Refresh  
t
32  
32  
32  
32  
32  
RPC  
CSR  
CHR  
ns  
ns  
ns  
t
t
t
10  
5
10  
5
to  
Precharge Time  
CAS  
10  
10  
10  
10  
10  
10  
10  
10  
10  
RAS  
CAS  
CAS  
1,18  
1,19  
Setup Time(CBR REFRESH)  
Hold Time(CBR REFRESH)  
7
7
Hold Time From  
Write Cycle  
During Read-Mode-  
WE  
High Setup Time  
CAS  
OE  
OEH  
OES  
ns  
16  
t
t
4
4
4
4
5
ns  
ns  
ns  
4
2
2
4
2
2
Low to  
4
2
2
4
2
2
5
2
2
OE  
OE  
OE  
OE  
OEHC  
t
High Hold Time From  
Precharge Time  
High  
CAS  
OEP  
t
Setup Prior to  
During Hidden Refresh  
RAS  
ORD  
ns  
ns  
t
0
4
0
5
0
5
0
5
0
6
Cycle  
Last  
High  
Going Low to First  
Returning  
CAS  
CAS  
CLCH  
21  
t
COH  
ns  
ns  
t
3
3
3
3
Data Output Hold After  
Returning Low  
3
3
3
3
3
3
CAS  
WHZ  
t
7
7
7
7
7
Output Disable Delay From  
WE  
µ s  
RASS  
RPS  
27,28  
27,28  
27,28  
t
100  
43  
-50  
5
Self Refresh  
Self Refresh  
Self Refresh  
Low Pulse width  
High Precharge Time  
Hold Time  
100  
55  
-50  
100  
65  
-50  
100  
75  
-50  
RAS  
RAS  
CAS  
ns  
ns  
t
5
CHS  
t
-50  
Elite Memory Technology Inc  
Publication Date: Agu. 2001  
Revision : 1.3 5/16  
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