EBE10AD4AGFA
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value
Comments
7.5ns
Minimum row active to row active delay
28
29
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
1EH
3CH
(tRRD)
Minimum /RAS to /CAS delay (tRCD)
15ns
Minimum active to precharge time
30
(tRAS)
0
0
1
0
1
1
0
1
2DH
45ns
-6E, -5C
-4A
0
0
0
0
1
0
0
0
1
0
0
0
0
0
0
1
28H
01H
40ns
1GB
31
32
Module rank density
Address and command setup time
before clock (tIS)
-6E
0
0
1
0
0
0
0
0
20H
0.20ns*1
-5C
-4A
0
0
0
0
1
1
0
1
0
0
1
1
0
0
1
1
25H
35H
0.25ns*1
0.35ns*1
Address and command hold time after
clock (tIH)
-6E
33
0
0
1
0
1
0
0
0
28H
0.28ns*1
-5C
-4A
0
0
0
1
1
0
1
0
1
1
0
0
0
0
0
0
38H
48H
0.38ns*1
0.48ns*1
Data input setup time before clock
(tDS)
34
35
0
0
0
1
0
0
0
0
10H
0.10ns*1
-6E, -5C
-4A
0
0
0
0
0
0
1
1
0
1
1
0
0
0
1
0
15H
18H
0.15ns*1
0.18ns*1
Data input hold time after clock (tDH)
-6E
-5C
0
0
0
0
0
0
1
1
1
0
0
1
0
1
1
0
0
1
1
0
0
1
0
0
23H
28H
3CH
0.23ns*1
0.28ns*1
15ns*1
-4A
36
37
Write recovery time (tWR)
Internal write to read command delay
(tWTR)
0
0
0
1
1
1
1
0
1EH
7.5ns*1
-6E, -5C
-4A
0
0
0
0
1
0
0
1
1
1
0
1
0
1
0
0
28H
1EH
10ns*1
7.5ns*1
Internal read to precharge command
delay (tRTP)
38
39
40
Memory analysis probe characteristics 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
00H
00H
TBD
Extension of Byte 41 and 42
0
0
0
0
1
0
Undefined
Active command period (tRC)
-6E, -5C
41
0
0
1
0
0
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
1
1
0
0
0
0
1
0
0
0
0
1
1
0
0
3CH
37H
69H
80H
18H
60ns*1
55ns*1
105ns*1
8ns*1
-4A
Auto refresh to active/
42
43
44
Auto refresh command cycle (tRFC)
SDRAM tCK cycle max. (tCK max.)
Dout to DQS skew
-6E
0.24ns*1
-5C
-4A
0
0
0
0
0
1
1
0
1
0
1
0
1
1
0
1
1EH
23H
0.30ns*1
0.35ns*1
Data hold skew (tQHS)
-6E
45
0
0
1
0
0
0
1
0
22H
0.34ns*1
-5C
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
1
1
1
0
0
1
1
0
0
0
1
0
0
1
1
0
28H
2DH
0FH
00H
0.40ns*1
0.45ns*1
15µs
-4A
46
PLL relock time
47 to 61
Preliminary Data Sheet E0865E11 (Ver. 1.1)
6