Appendix C: Manufacturing Information
The XBee is designed for surface mount on the OEM PCB. It has castellated pads to allow for easy solder attach
inspection. The pads are all located on the edge of the module, so that there are no hidden solder joints on these
modules.
Recommended Solder Reflow Cycle
The recommended solder reflow cycle is shown below. The chart shows the temperature setting and the time to
reach the temperature. The cooling cycle is not shown.
Time (seconds)
Temperature (degrees C)
30
60
65
100
135
160
195
240
260
90
120
150
180
210
The maximum temperature should not exceed 260 degrees Celsius.
The module will reflow during this cycle, and therefore must not be reflowed updside down. Care should be
taken not to jar the module while the solder is molten, as parts inside the module can be removed from their
required locations.
Hand soldering is possible and should be done in accordance with approved standards.
© 2010 Digi International, Inc.
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DCD [ DIGITAL CORE DESIGN ]
