XBee®/XBee‐PRO® ZB SMT RF Modules
Flux and Cleaning
It is recommended that a “no clean” solder paste be used in assembling these modules. This will eliminate the
clean step and ensure unwanted residual flux is not left under the module where it is difficult to remove. In
addition:
• Cleaning with liquids can result in liquid remaining under the shield or in the gap between the
module and the OEM PCB. This can lead to unintended connections between pads on the mod-
ule.
• The residual moisture and flux residue under the module are not easily seen during an inspec-
tion process.
Factory recommended best practice is to use a “no clean” solder paste to avoid the issues above and ensure
proper module operation.
Reworking
Rework should never be performed on the module itself. The module has been optimized to give the best
possible performance, and reworking the module itself will void warranty coverage and certifications. We
recognize that some customers will choose to rework and void the warranty; the following information is given
as a guideline in such cases to increase the chances of success during rework, though the warranty is still
voided.
The module may be removed from the OEM PCB by the use of a hot air rework station, or hot plate. Care should
be taken not to overheat the module. During rework, the module temperature may rise above its internal solder
melting point and care should be taken not to dislodge internal components from their intended positions.
© 2010 Digi International, Inc.
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DCD [ DIGITAL CORE DESIGN ]
