XBee®/XBee‐PRO® ZB SMT RF Modules
Recommended Footprint
It is recommended that you use the PCB footprint shown below for surface mounting. Dimensions are in inches.
The solder footprint should be matched to the copper pads, but may need to be adjusted depending on the
specific needs of assembly and product standards.
While the underside of the module is mostly coated with solder resist, it is recommended that the copper layer
directly below the module be left open to avoid unintended contacts. Copper or vias must not interfere with the
three exposed RF test points on the bottom of the module (see below). Furthermore, these modules have a
ground plane in the middle on the back side for shielding purposes, which can be affected by copper traces
directly below the module.
ꢀꢁꢈꢄꢆ
ꢐꢈꢀꢀꢊꢑ
ꢒꢊꢊꢀꢓꢈꢔꢇ
© 2010 Digi International, Inc.
151
DCD [ DIGITAL CORE DESIGN ]
