CY8C9520A, CY8C9540A
CY8C9560A
Thermal Impedances
Table 28. Thermal Impedances per Package
a
Package
28 SSOP
48 SSOP
100 TQFP
Typical θJA
101oC/W
69oC/W
48oC/W
a. TJ = TA + POWER x θ
JA
Solder Reflow Peak Temperature
Table 29 lists the minimum solder reflow peak temperature to achieve good solderability.
Table 29. Solder Reflow Peak Temperature
Package
28 SSOP
48 SSOP
100 TQFP
Minimum Peak Temperaturea
Maximum Peak Temperature
240oC
220oC
220oC
260oC
260oC
260oC
a. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5oC with Sn-Pb or 245+/-5oC with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.
Document Number: 38-12036 Rev. *B
Page 22 of 24
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