CY7C1041DV33
Capacitance
Parameter
C
IN
C
OUT
Description
Input capacitance
I/O capacitance
Test Conditions
T
A
= 25
°C,
f = 1 MHz, V
CC
= 3.3 V
Max
8
8
Unit
pF
pF
Thermal Resistance
Parameter
Θ
JA
Θ
JC
Description
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
four layer printed circuit board
FBGA
Package
27.89
14.74
SOJ
Package
57.91
36.73
TSOP II
Package
50.66
17.17
Unit
°C/W
°C/W
AC Test Loads and Waveforms
The AC test loads and waveform diagram follows.
10 ns device
OUTPUT
50
Ω
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
High-Z Characteristics
3.3V
OUTPUT
5 pF
R2
351Ω
(c)
R 317Ω
1.5V
Rise Time: 1 V/ns
(a)
(b)
Fall Time: 1 V/ns
30 pF*
Z = 50
Ω
3.0V
GND
ALL INPUT PULSES
90%
10%
90%
10%
Notes
7. Tested initially and after any design or process changes that may affect these parameters.
8. AC characteristics (except high Z) are tested using the load conditions shown in
(a). High Z characteristics are tested for all speeds
using the test load shown in (c).
Document Number: 38-05473 Rev. *I
Page 5 of 17
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