CY7C1360B
CY7C1362B
Thermal Resistance[15]
TQFP
BGA
fBGA
Parameter
Description
Test Conditions
Package
Package
Package
Unit
ΘJA
Thermal Resistance
Test conditions follow standard
test methods and procedures
for measuring thermal
25
25
27
°C/W
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
9
6
6
°C/W
impedance, per EIA / JESD51.
Capacitance[15]
TQFP
BGA
fBGA
Parameter
Description
Test Conditions
Package
Package
Package
Unit
pF
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
5
5
5
5
5
7
5
5
7
VDD = 3.3V.
CCLK
CI/O
Clock Input Capacitance
Input/Output Capacitance
pF
V
DDQ = 2.5V
pF
AC Test Loads and Waveforms
3.3V I/O Test Load
R = 317Ω
3.3V
OUTPUT
OUTPUT
ALL INPUT PULSES
90%
VDD
90%
10%
Z = 50Ω
0
10%
R = 50Ω
L
GND
5 pF
R = 351Ω
≤ 1 ns
≤ 1 ns
V = 1.5V
L
INCLUDING
JIG AND
SCOPE
(c)
(a)
(b)
2.5V I/O Test Load
R = 1667Ω
2.5V
OUTPUT
R = 50Ω
OUTPUT
ALL INPUT PULSES
90%
VDD
90%
10%
Z = 50Ω
0
10%
L
GND
≤ 1 ns
5 pF
R =1538Ω
≤ 1 ns
V = 1.25V
L
INCLUDING
JIG AND
SCOPE
(c)
(a)
(b)
Note:
15. Tested initially and after any design or process change that may affect these parameters.
Document #: 38-05291 Rev. *C
Page 24 of 34
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