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BCM43570KFFBG 参数 Datasheet PDF下载

BCM43570KFFBG图片预览
型号: BCM43570KFFBG
PDF下载: 下载PDF文件 查看货源
内容描述: [Single-Chip 5G WiFi IEEE 802.11ac 2×2MAC/Baseband/Radio with IntegratedBluetooth 4.1 and EDR]
分类和应用:
文件页数/大小: 93 页 / 8056 K
品牌: CYPRESS [ CYPRESS ]
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ADVANCE  
CYW43570  
9. PCI Express Interface  
The PCI Express (PCIe) core on the CYW43570 is a high-performance serial I/O interconnect that is protocol compliant and electrically  
compatible with the PCI Express Base Specification v2.0. This core contains all the necessary blocks, including logical and electrical  
functional subblocks to perform PCIe functionality and maintain high-speed links, using existing PCI system configuration software  
implementations without modification.  
Organization of the PCIe core is in logical layers: Transaction Layer, Data Link Layer, and Physical Layer, as shown in Figure 19. A  
configuration or link management block is provided for enumerating the PCIe configuration space and supporting generation and  
reception of System Management Messages by communicating with PCIe layers.  
Each layer is partitioned into dedicated transmit and receive units that allow point-to-point communication between the host and  
CYW43570 device. The transmit side processes outbound packets whereas the receive side processes inbound packets. Packets  
are formed and generated in the Transaction and Data Link Layer for transmission onto the high-speed links and onto the receiving  
device. A header is added at the beginning to indicate the packet type and any other optional fields.  
Figure 19. PCI Express Layer Model  
Hardware/Software  
Interface  
Hardware/Software  
Interface  
Transaction Layer  
Data Link Layer  
Transaction Layer  
Data Link Layer  
Physical Layer  
Physical Layer  
Logical Subblock  
Logical Subblock  
Electrical Subblock  
Electrical Subblock  
TX  
RX  
TX  
RX  
9.1 Transaction Layer Interface  
The PCIe core employs a packet-based protocol to transfer data between the host and CYW43570 device, delivering new levels of  
performance and features. The upper layer of the PCIe is the Transaction Layer. The Transaction layer is primarily responsible for  
assembly and disassembly of transaction layer packets (TLPs). TLP structure contains header, data payload, and end-to-end CRC  
(ECRC) fields, which are used to communicate transactions, such as read and write requests and other events.  
A pipelined full split-transaction protocol is implemented in this layer to maximize efficient communication between devices with credit-  
based flow control of TLP, which eliminates wasted link bandwidth due to retries.  
9.2 Data Link Layer  
The data link layer serves as an intermediate stage between the transaction layer and the physical layer. Its primary responsibility is  
to provide reliable, efficient mechanism for the exchange of TLPs between two directly connected components on the link. Services  
provided by the data link layer include data exchange, initialization, error detection and correction, and retry services.  
The data link layer packets (DLLPs) are generated and consumed by the data link layer. DLLPs are the mechanism used to transfer  
link management information between data link layers of the two directly connected components on the link, including TLP acknowl-  
edgement, power management, and flow control.  
Document Number: 002-15054 Rev. *I  
Page 39 of 94  
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