Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚Cꢀ-0.5˚CꢀSEC.
REFLOW HEATING RATE 2.5˚C 0.5˚CꢀSEC.
PEAK
TEMP.
245˚C
PEAK
TEMP.
240˚C
PEAK
TEMP.
230˚C
200
100
2.5˚C 0.5˚CꢀSEC.
SOLDERING
TIME
200˚C
30
160˚C
150˚C
140˚C
SEC.
30
SEC.
3˚C + 1˚Cꢀ-0.5˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Use of non-chlorine-activated fluxes is highly recommended.
Recommended Lead Free IR Profile
TIME WITHIN 5˚C of ACTUAL
PEAK TEMPERATURE
t
p
20-40 SEC.
260 +0/-5˚C
Tp
TL
217˚C
RAMP-UP
3˚C/SEC. MAX.
RAMP-DOWN
6˚C/SEC. MAX.
150 - 200˚C
Tsmax
Tsmin
ts
tL
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25˚C to PEAK
TIME (SECONDS)
NOTES:
THE TIME FROM 25˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
smax = 200˚C, Tsmin = 150˚C
T
Note: Use of non-chlorine-activated fluxes is highly recommended.
Regulatory Information
The HCPL-7860/HCPL-786J has been approved by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2
UL
Approval under UL 1577, component recognition pro-
gram. File E55361.
CSA
Approval under CSA Component Acceptance Notice #5,
File CA 88324.
(VDE 0884 Teil 2):2003-01.
5
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
