COTS PEM
BOOT SECTOR FLASH
Austin Semiconductor, Inc.
AS29LV016J
DC CHARACTERISTICS
CMOS Compatible
Parameter
ILI
Description
Input Load Current
Test Conditions
Min
Typ
Max
Unit
VIN=VSS to VCC, VCC=VCCmax
1.0
VCC=VCCmax, Wp#= VSS to VCC
VCC=VCCmax; A9=12.5V
WP# Input Load Current
A9 Input Load Current
Output Leakage Current
25
µA
ILIT
ILO
35
1.0
12
4
V
OUT=VSS to VCC, VCC=VCCmax
CE#=VIL, OE#-VIH, Byte Mode
CE#=VIL, OE#-VIH, Word Mode
CE#=VIL, OE#=VIH, VCC=VCCmax
5 MHz
1 MHz
5 MHz
1 MHz
7
2
VCC Active Read Current 1,2
ICC1
mA
7
12
4
2
VCC Erase/Program Current 2,3,4
VCC Standby Current 2,4
ICC2
20
30
mA
µA
OE3=VIH.
CE#,
RESET#=VCC 0.3V/-0.1V,
WP#=Vcc or open, Vccmax 5
ICC3
0.2
10
Vcc=Vccmax, RESET#=VSS 0.3V/-0.1V
WP#=Vcc or open5
VCC Standby Current During Reset 2,4
ICC4
0.2
0.2
µA
µA
Automatic Sleep Mode 2,4,6
Input Low Voltage
VIH=VCC 0.3V; VIL=VSS 0.3V
ICC5
VIL
-0.1
0.8
VIH
0.7 x VCC
VCC + 0.3
Input High Voltage
Voltage for Autoselect and Temporary
Sector Unprotect
VID
VCC=2.7-3.6V
8.5
12.5
0.45
V
IOL=4.0 mA, VCC=VCCmin
IOH=-2.0 mA, VCC=VCCmin
IOH=-100 µA, VCC=VCCmin
VOL
Output Low Voltage
VOH1
VOH2
VLKO
.85xVcc
VCC-0.4
2.3
Output High Voltage
Low VCC Lock-Out Voltage
2.5
Notes:
1.The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH. Typical VCC is 3.0 V.
2.CC active while Embedded Erase or Embedded Program is in progress.
3. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns.
4.Not 100% tested.
5.When the device is operated in Extended Temperature range, the currents are as follows:
ICC3-0.2µA (typ), 10µA (max)
ICC4-0.2µA (typ), 10µA (max)
ICC5-0.2µA (typ), 10µA (max)
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
AS29LV016J
Rev. 0.0 02/09
27