APA2030/2031
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
tp
TP
Critical =one
TL to TP
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
°
t 25 C to Peak
Time
Classificatin Reflow Profiles
Sn-Pb Eutectic Assembly
Large Body Small Body
Pb-Free Assembly
Profile Feature
Large Body
Small Body
Average ramp-up rate
(TL to TP)
3°C/second max.
3°C/second max.
Preheat
ꢀ Temperature Min (Tsmin)
ꢀ Temperature Mix (Tsmax)
ꢀ Time (min to max)(ts)
100°C
150°C
150°C
200°C
60-120 seconds
60-180 seconds
Tsmax to TL
3°C/second max
- Ramp-up Rate
Tsmax to TL
ꢀ Temperature(TL)
ꢀ Time (tL)
183°C
217°C
60-150 seconds
60-150 seconds
Peak Temperature(Tp)
225 +0/-5°C
10-30 seconds
240 +0/-5°C
245 +0/-5°C
250 +0/-5°C
Time within 5°C of actual Peak
10-30 seconds
10-30 seconds 20-40 seconds
Temperature(tp)
Ramp-down Rate
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.
25
www.anpec.com.tw
Rev. A.2 - Apr., 2004
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
