APA2030/2031
Packaging Information
TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153)
e
N
2 x E / 2
E1
E
1
b
2
3
e/2
D
A2
A
(
2)
A1
GAUGE
PLANE
D1
S
EXPOSED THERMAL
PAD =ONE
E2
0.25
L
1
(L1)
(
3)
BOTTOM VIEW
(THERMALLY ENHANCED VARIATIONDS ONLY)
Millimeters
Inches
Dim
Min.
Max.
1.2
Min.
Max.
0.047
0.006
0.041
A
A1
A2
0.00
0.15
1.05
0.000
0.031
0.80
6.4 (N=20PIN)
7.7 (N=24PIN)
9.6 (N=28PIN)
6.6 (N=20PIN)
7.9 (N=24PIN)
9.8 (N=28PIN)
0.252 (N=20PIN) 0.260 (N=20PIN)
0.303 (N=24PIN) 0.311 (N=24PIN)
0.378 (N=28PIN) 0.386 (N=28PIN)
0.165 BSC (N=20PIN)
0.188 BSC (N=24PIN)
0.150 BSC (N=28PIN)
0.026 BSC
D
4.2 BSC (N=20PIN)
D1
4.7 BSC (N=24PIN)
3.8 BSC (N=28PIN)
0.65 BSC
e
E
6.40 BSC
0.252 BSC
E1
E2
4.30
4.50
0.169
0.177
3.0 BSC (N=20PIN)
3.2 BSC (N=24PIN)
2.8 BSC (N=28PIN)
0.118 BSC (N=20PIN)
0.127 BSC (N=24PIN)
0.110 BSC (N=28PIN)
L
L1
R
0.45
0.75
0.018
0.030
1.0 REF
0.039REF
0.09
0.09
0.2
0.004
0.004
0.008
R1
S
12° REF
12° REF
12 REF
12 REF
°
°
Copyright ANPEC Electronics Corp.
24
www.anpec.com.tw
Rev. A.2 - Apr., 2004
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
