AS3525-A/-B C22O22
Data Sheet, Confidential
8
Pinout and Packaging
8.1 Package Variants
CTBGA (Thin ChipArray BGA) package technology is used for multi-chip-module (MCM) packaging. The following package variants are
available for the product:
Table 160 Package Options
Product
Code
Package Balls
Ball Matrix
Pitch
[mm]
Height
[mm]
Size
Application
[mm]
AS3525-A
AS3525-B
CTBGA
CTBGA
224
144
15x15, 7 Row
12x12, full
0.8
0.8
1.2
1.2
13x13
10x10
with external SDRAM interface
w/o external SDRAM interface
8.2 CTBGA224 Package Drawings
8.2.1 Marking
Figure 60 CTBGA224 Package Marking
AS3525A
C22O22
AYWWZZZ
Package Code AYYWWZZZ
A
Y
WW
ZZZ
A … for PB free
Year
working week assembly/packaging
Free choice
Figure 61 CTBGA224 Package Drawing
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