QT2022/32 - Data Sheet: DS3051
17 Thermal
The QT2022/32 190-ball LBGA package incorporates state-of-the-art high speed performance in a low-cost plastic
package with an advanced thermal solution. There are two primary thermal paths, junction-to-case (JC) and junc-
tion-to-ball (JB).
The central 5x5 ball array on the package provide 25 thermal relief paths into the PCB substrate. These are used
as a primary heat dissipation path for the chip. To optimize thermal performance, please ensure there is a ground
via for each thermal ball in the layout. Thermal modelling is based on a 1S2P multilayer JEDEC standard
(100x100mm), 1.6mm FR4 PCB.
The thermal model for the package is given in Figure 56. Package thermal parameters are given in Table 56, “190B
LBGA Package Constants,” on page 188.
Figure 56: LBGA Thermal Model
TA
θ
CA
T
C
PACKAGE
θ
BA
θ
JC
DIE
θJB
T
J
PCB
208
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