QT2022/32 - Data Sheet: DS3051
15.1 PCB Layout Recommendations
A recommended NSMD (No Solder Mask Defined) pad structure is given in Figure 53. The structure and values
are recommendations only, and will vary with manufacturing process.
2
Figure 53: Recommended PCB layout for BGA landing pad for 15x15 mm package.
O0.016”
PAD
O 0.021”
SOLDER MASK
OPENING
VIA
15.2 Baking instructions
To remove moisture, bake at 125°C for 14 hours using an oven with nitrogen purge per IPC / JEDEC J-STD-033.
Baking removes the remote chance of popcorn effects during the reflow process.
15.3 Thermal Reflow Profile
The recommended reflow profile for the QT2022/32 is shown in Figure 54. Peak temperatures are shown for both
the leaded and lead-free versions of the products. The lead-free version has a peak temperature of 260°C. The
standard leaded version has a peak temperature of 225°C.
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