QT2022/32 - Data Sheet: DS3051
Figure 54: Recommended Reflow Profile
Peak temp:
220 (+5/-0) °C (PbSn)
or 260 (+0/-5) °C (SnAgCu)
225 / 260°C
220 / 255°C
Average ramp-up rate
(183°C to 220°C / 255°C)
1.0-2.0°C/sec : 225°C peak
1.5-2.5°C/sec : 260°C peak
183°C
150°C
Average ramp-down rate
6°C/sec max
100°C
Time at
peak temp
10-20s
Preheat time at
125 (+/-25)°C
60-120s
Time above 183°C
Note: reflow profile for SnPb solder and SnAgCu
solder is the same except for peak temperature.
Peak temp for SnPb is 225°C; for SnAgCu it is 260°C.
60-150s
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