Revision 1.19 – June 17, 2009
460EX – PPC460EX Embedded Processor
Preliminary Data Sheet
Package Diagram
Figure 3. 35mm, 728-Ball TE-PBGA Package
Top View
Logo View
Part
Number
®
24
30
TYP TYP
PPC460EX e1
PPC460EX-nprfff(f)T
ccccccc
Heat Slug
1YWWBZZZZZ MMDDQL
Side View
2.65 max
Mold
Compound
Lot Number (ZZZZZ)
PCB
Substrate
Gold Gate Release
Corresponds to
A01 Ball Location
Bottom View
0.4 - 0.6
35.0
33.0
AP
AM
AK
AH
AN
AL
AJ
1.0
AG
AF
AD
AB
Y
AE
AC
AA
W
U
Thermal Balls
Notes: 1. All dimensions are in mm.
2. Package is available with lead or
lead-free (RoHS compliant).
3. Package conforms to JEDEC MS-034.
4. Optional solder ball diameter is
V
T
R
0.63 +0.07/−0.13.
P
N
7.0
M
K
L
J
H
G
F
E
D
C
B
A
19 21 23
27 29 31 33
01 03 05 07 09 11 13 15 17
08 10
25
22 26 28
24
06
12 14
30
34
32
04
16 18
02
20
728 x 0.60 0.10 Solder Ball
AMCC Proprietary
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23
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
