Revision 1.19 – June 17, 2009
460EX – PPC460EX Embedded Processor
Assembly Recommendations
Preliminary Data Sheet
Assembly recommendations from JEDEC standard J-STD-020 should be used unless recommended differently in
the following table.
Table 3. Recommended Reflow Soldering Profile
Sn-Pb Eutectic Assembly
(PPC460EX-STxfff)
Pb Free Reflow Assembly
(PPC460EX-SUxfff)
Profile Feature
Average ramp-up rate
Preheat:
3°C/second max
3°C/second max
•
•
•
Temperature Min
Temperature Max
Time (min to max)
100°C
150°C
150°C
200°C
60–120 seconds
60–120 seconds
Time Maintained Above:
•
•
Temperature
Time
183°C
60–150 seconds
217°C
60–150 seconds
Peak Temperature
225°C
260°C
Time within 5°C of Actual Peak Temperature
Ramp-down Rate
20 seconds max
6°C/second max
6 minutes max
30 seconds max
6°C/second max
8 minutes max
Time 25°C to Peak Temperature
Table 4. JEDEC Moisture Sensitivity Level and Ball Composition
Sn-Pb (PPC460EX-STxfff)
Pb Free (PPC460EX-SUxfff)
MSL Level
3
3
Solder Ball Metallurgy
63Sn/37Pb
Sn/4Ag/05Cu
24
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