Revision 1.26 – October 15, 2007
440EPx – PPC440EPx Embedded Processor
Assembly Recommendations
Preliminary Data Sheet
Table 3. Recommended Reflow Soldering Profile
Profile Feature
Average ramp-up rate
Preheat
Sn-Pb Eutectic Assembly
Pb Free Reflow Assemble
3°C/Second Max
3°C/Second Max
•
•
•
Temperature Min
Temperature Max
Time (min to max)
100°C
150°C
150°C
180°C
60-120 Seconds
60-120 Seconds
Time Maintained Above:
•
•
Temperature
Time
183°C
60-150 Seconds
230°C
30-50 Seconds
Peak Temperature
225 +0/-5°C
260 +5/-0°C
Time within 5°C of Actual Peak Temperature
Ramp-down Rate
10-30 Seconds
6°C/Second Max
6 Minutes Max
10-20 Seconds
6°C/Second Max
8 Minutes Max
Time 25°C to Peak Temperature
Table 4. JEDEC Moisture Sensitivity Level and Ball Composition
Sn-Pb Eutectic Assembly
Pb Free Reflow Assembly
MSL Level
3
3
Solder Ball Metallurgy
63Sn/37Pb
Sn/4Ag/05Cu
20
AMCC Proprietary
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
