Revision 1.26 – October 15, 2007
440EPx – PPC440EPx Embedded Processor
Preliminary Data Sheet
Package Diagram
Figure 3. 35mm, 680-Ball TE-PBGA Package
Top View
Logo View
Part
Number
®
24
30
TYP TYP
PPC440EPx e1
PPC440EPx-nprffft
ccccccc
Heat Slug
1YWWBZZZZZ MMDDQL
Side View
2.65 max
Mold
Compound
Lot Number (ZZZZZ)
PCB
Substrate
Gold Gate Release
Corresponds to
A01 Ball Location
Bottom View
0.4 - 0.6
35.0
± 0.20
33.0
AP
AM
AK
AH
AN
AL
AJ
1.0
AG
AF
AD
AB
Y
AE
AC
AA
W
U
Thermal Balls
Notes: 1. All dimensions are in mm.
2. Package is available with lead or
lead-free (RoHS compliant).
3. Package conforms to JEDEC MS-034.
V
T
R
P
N
M
K
L
9.0
J
H
G
E
F
D
C
B
A
27 29 31
19 21 23
33
34
01 03 05 07 09 11 13 15 17
08 10
25
22
26 28
24
06
12 14
30
04
16 18
32
02
20
680 x 0.60 ± 0.10 Solder Ball
AMCC Proprietary
19
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
