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EPM240T100C5 参数 Datasheet PDF下载

EPM240T100C5图片预览
型号: EPM240T100C5
PDF下载: 下载PDF文件 查看货源
内容描述: [最大II器件]
分类和应用: 可编程逻辑器件输入元件PC
文件页数/大小: 295 页 / 3815 K
品牌: ALTERA [ ALTERA CORPORATION ]
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Chapter 17: Understanding and Evaluating Power in MAX II Devices  
17–15  
Power Saving Techniques  
Table 17–8. Thermal Analysis Information  
Column Heading  
Description  
Junction Temp, TJ (°C)  
θJA Junction-Ambient  
Represents the estimated device junction temperature.  
Represents the junction-to-ambient thermal resistance through the top of the device  
(°C/W).  
Maximum Allowed TA (°C)  
Represents a guideline for the maximum ambient temperature (°C) that the device can  
be subjected to without violating maximum junction temperature.  
Power Supply Current  
The power supply current provides the estimated current consumption for power  
supplies. The ICCPOWERUP is only applicable during power up when the configuration  
flash memory (CFM) block downloads to the SRAM. The ICCINT current is the supply  
current required from VCCINT. The total ICCIO current is the supply current required from  
V
CCIO for all I/O banks. For estimates of ICCIO based on I/O banks, refer to the “I/O  
Section” on page 17–8 of the PowerPlay Early Power Estimator spreadsheet.  
Figure 17–16 shows the Power Supply Current section.  
Figure 17–16. Power Supply Current  
Table 17–9 describes the Power Supply Current parameters of the PowerPlay Early  
Power Estimator spreadsheet.  
Table 17–9. Power Supply Current Information  
Column Heading  
ICCPOWERUP  
ICCINT  
ICCIO  
Description  
Represents the maximum current drawn during power-up.  
Represents the total current drawn from the ICCINT supply.  
Represents the total current drawn from the ICCIO power rail(s). Refer to the  
“I/O Section” on page 17–8 for details about the current drawn from each  
I/O rail.  
Power Saving Techniques  
The following guidelines reduce power consumption for an application:  
Slow the operation in portions of the circuit. ICC is proportional to the frequency of  
operation. Slowing parts of a circuit lowers the ICC and therefore reduces the  
power. MAX II devices provide global or array clock source for all registers.  
Signals that do not require high-speed operation can use a slower array clock that  
reduces the system power consumption.  
Reduce the number of outputs. Standby and dynamic current are required to  
support all I/O pins on the device. Reducing the number of I/O pins can reduce  
current necessary for the device, and thereby reduce the power.  
© October 2008 Altera Corporation  
MAX II Device Handbook  
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