Referenced Documents
Figure 6–1. MAX II Device Packaging Ordering Information
EPM
240
G
T
100
C
3
ES
Family Signature
EPM: MAX II
Optional Suffix
Indicates specific device
options or shipment method
ES: Engineering sample
N: Lead-free packaging
Device Type
240:
570:
1270:
2210:
240 Logic Elements
570 Logic Elements
1,270 Logic Elements
2,210 Logic Elements
Speed Grade
3, 4, 5, 6, or 7, with 3 being the fastest
Product-Line Suffix
Indicates device type
Operating Temperature
C: Commercial temperature (TJ = 0
°
C to 85
C to 100
A: Automotive temperature (TJ = -40
°
C)
C)
G:
Z:
1.8-V VCCINT low-power device
1.8-V VCCINT zero-power device
2.5-V or 3.3-V VCCINT device
I: Industrial temperature (TJ = -40
°
°
°
C to 125
°
C)
Blank (no identifier):
Package Type
Thin quad flat pack (TQFP)
T:
FineLine BGA
F:
M: Micro FineLine BGA
Pin Count
Number of pins for a particular package
This chapter references the following document:
Package Information chapter in the MAX II Device Handbook
Referenced
Documents
■
6–2
Core Version a.b.c variable
Altera Corporation
December 2007
MAX II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
