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Package
Package Layout Recommendation
Sharp flash-based EPC16 and EPC8 devices in the 100-pin PQFP packages have
different package dimensions than other Altera 100-pin PQFP devices (including the
Micron flash-based EPC4 and Intel flash-based EPC16, EPC8, and EPC4). Figure 9
shows the 100-pin PQFP PCB footprint specifications for EPC devices that allows
vertical migration between all devices. These footprint dimensions are based on
vendor-supplied package outline diagrams.
(2)
Figure 9. EPC Device PCB Footprint Specifications for 100-Pin PQFP Packages (1),
0.65-mm Pad Pitch
0.325 mm
19.3 mm
0.410 mm
25.3 mm
2.4 mm
0.5
1.5
1.0
2.0mm
Notes to Figure 9:
(1) Used 0.5-mm increase for front and back of nominal foot length.
(2) Used 0.3-mm increase to maximum foot width.
f For more information about package outline drawings, refer to the Package and
Thermal Resistance page.
Enhanced Configuration (EPC) Devices Datasheet
January 2012 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
