Package Information Datasheet for Mature Altera Devices
Thermal Resistance
27
Table 28. Thermal Resistance of Stratix Devices (Part 2 of 2)
JA (° C/W)
JA (° C/W)
JA (° C/W)
JA (° C/W)
Device
Package
Pin Count
780
JC (° C/W)
0.2
Still Air
100 ft./min.
200 ft./min.
400 ft./min.
FBGA,
Flip Chip
10.4
9.1
9.9
10.4
9.0
9.8
9.1
8.9
9.7
8.9
8.8
9.6
8.8
8.4
7.1
7.9
8.3
7.0
7.8
7.1
6.9
7.7
7.0
6.8
7.6
6.9
7.0
5.8
6.5
6.9
5.7
6.4
5.8
5.6
6.3
5.6
5.5
6.2
5.5
5.9
4.8
5.4
5.8
4.7
5.3
4.7
4.6
5.2
4.6
4.5
5.1
4.5
BGA,
Flip Chip
EP1S30
956
0.2
FBGA,
Flip Chip
1020
780
0.2
FBGA,
Flip Chip
0.2
BGA,
Flip Chip
956
0.2
EP1S40
FBGA,
Flip Chip
1020
1508
956
0.2
FBGA,
Flip Chip
0.2
BGA,
Flip Chip
0.1
FBGA,
Flip Chip
EP1S60
EP1S80
1020
1508
956
0.1
FBGA,
Flip Chip
0.1
BGA,
Flip Chip
0.1
FBGA,
Flip Chip
1020
1508
0.1
FBGA,
Flip Chip
0.1
Cyclone Series Devices Thermal Resistance
Table 29 to Table 30 provide thermal resistance values for Cyclone series devices.
Cyclone II Devices
Table 29 lists the thermal resistance of Cyclone II devices.
Table 29. Thermal Resistance of Cyclone II Devices (Part 1 of 2)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
Device
Package
Pin Count
JC (° C/W)
TQFP,
Wire Bond
144
10.0
31.0
29.3
29.2
26.1
27.9
27.3
23.6
25.5
22.3
21.7
PQFP,
Wire Bond
EP2C5
208
256
5.5
8.7
30.4
30.2
FBGA,
Wire Bond
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
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