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EP1AGX60 参数 Datasheet PDF下载

EP1AGX60图片预览
型号: EP1AGX60
PDF下载: 下载PDF文件 查看货源
内容描述: 对于成熟的Altera器件封装信息数据表 [Package Information Datasheet for Mature Altera Devices]
分类和应用:
文件页数/大小: 182 页 / 2063 K
品牌: ALTERA [ ALTERA CORPORATION ]
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Package Information Datasheet for Mature Altera Devices  
Device and Package Cross Reference  
15  
APEX 20KC Devices  
Table 15 lists the device name, package type, and number of pins for the APEX 20KC  
device family.  
1
The package type entries with “Option #” refer to instances where multiple package  
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe  
specific type used by the corresponding device density.  
Table 15. APEX 20KC Devices  
Device  
Package  
Pins  
208  
240  
356  
484  
652  
672  
652  
672  
1020  
652  
672  
1020  
PQFP, Wire Bond  
PQFP, Wire Bond  
BGA, Wire Bond  
EP20K200C  
FBGA, Wire Bond, Option 2  
BGA, Wire Bond, Option 3  
FBGA, Flip Chip, Option 1  
BGA, Wire Bond, Option 3  
FBGA, Flip Chip, Option 1  
FBGA, Flip Chip, Option 1  
BGA, Flip Chip  
EP20K400C  
EP20K600C  
EP20K1000C  
FBGA, Flip Chip, Option 1  
FBGA, Flip Chip, Option 1  
APEX 20K Devices  
Table 16 lists the device name, package type, and number of pins for the APEX 20K  
device family.  
1
The package type entries with “Option #” refer to instances where multiple package  
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe  
specific type used by the corresponding device density.  
Table 16. APEX 20K Devices (Part 1 of 2)  
Device  
Package  
Pins  
144  
208  
240  
324  
356  
240  
144  
TQFP, Wire Bond  
PQFP, Wire Bond  
PQFP, Wire Bond  
EP20K100  
FBGA, Wire Bond, Option 1  
BGA, Wire Bond  
PQFP, Wire Bond  
EP20K160  
TQFP, Wire Bond  
© December 2011 Altera Corporation  
Package Information Datasheet for Mature Altera Devices  
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