Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
11
Table 9. MAX 3000A Devices (Part 2 of 2)
Device
Package
Pins
144
208
208
256
TQFP, Wire Bond
PQFP, Wire Bond
PQFP, Wire Bond
EPM3256A
EPM3512A
FBGA, Wire Bond, Option 1
HardCopy II Devices
Table 10 lists the device name, package type, and number of pins for the HardCopy II
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 10. HardCopy II Devices
Device
Package
FBGA, Wire Bond, A:2.40
Pins
484
HC210
Single-Piece Lid: FBGA, Flip Chip, Option 4
Single-Piece Lid: FBGA, Flip Chip, Option 3
Single-Piece Lid: FBGA, Flip Chip, Option 2
Single-Piece Lid: FBGA, Flip Chip, Option 2
Single-Piece Lid: FBGA, Flip Chip, Option 2
672
HC220
HC230
HC240
780
1020
1020
1508
HardCopy Devices
Table 11 lists the device name, package type, and number of pins for the HardCopy
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 11. HardCopy Devices
Device
Package
FBGA, Wire Bond, A:2.40
Pins
672
HC1S25
BGA, Wire Bond
672
HC1S30
HC1S40
HC1S60
HC1S80
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
780
780
1020
1020
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
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