Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
7
Cyclone II Devices
Table 5 lists the device name, package type, and number of pins for the Cyclone II
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 5. Cyclone II Devices
Device
Package
Pins
144
208
256
144
208
256
TQFP, Wire Bond
PQFP, Wire Bond
EP2C5
FBGA, Wire Bond, Option 2, Thin
TQFP, Wire Bond
EP2C8
PQFP, Wire Bond
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, Option 2, Thin
256
EP2C8A
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, A:2.40
PQFP, Wire Bond
256
484
240
256
484
256
484
484
484
672
484
484
672
672
896
EP2C15A
EP2C20
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, A:2.40
UBGA, Wire Bond
EP2C20A
EP2C35
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, A:2.40
UBGA, Wire Bond
EP2C50
EP2C70
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, A:2.40
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
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