8
Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Cyclone Devices
Table 6 lists the device name, package type, and number of pins for the Cyclone
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 6. Cyclone Devices
Device
Package
Pins
100
144
324
400
144
240
256
240
256
324
324
400
TQFP, Wire Bond
TQFP, Wire Bond
EP1C3
FBGA, Wire Bond, Option 1
FBGA, Wire Bond
EP1C4
EP1C6
TQFP, Wire Bond
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
PQFP, Wire Bond
EP1C12
EP1C20
FBGA, Wire Bond, Option 1
FBGA, Wire Bond, Option 1
FBGA, Wire Bond, Option 1
FBGA, Wire Bond
MAX 9000 Devices
Table 7 lists the device name, package type, and number of pins for the MAX 9000
device family.
Table 7. MAX 9000 Devices
Device
EPM9320
EPM9320A
EPM9560
Package
Pins
356
356
356
BGA, Wire Bond
BGA, Wire Bond
BGA, Wire Bond
MAX 7000 Devices
Table 8 lists the device name, package type, and number of pins for the MAX 7000
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Package Information Datasheet for Mature Altera Devices
© December 2011 Altera Corporation