10
Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Table 8. MAX 7000 Devices (Part 2 of 2)
Device
Package
Pins
100
100
144
208
256
144
208
256
256
44
TQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
EPM7256AE
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
PQFP, Wire Bond
EPM7512AE
EPM7032A
BGA, Wire Bond, Option 1
FBGA, Wire Bond, Option 1
PLCC, Wire Bond
TQFP, Wire Bond
44
PLCC, Wire Bond
84
TQFP, Wire Bond
100
100
144
256
100
144
208
256
160
160
EPM7128A
FBGA, Wire Bond
TQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
TQFP, Wire Bond
EPM7256A
EPM7192E
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
PGA, Wire Bond
PQFP, Wire Bond
MAX 3000A Devices
Table 8 lists the device name, package type, and number of pins for the MAX 3000A
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 9. MAX 3000A Devices (Part 1 of 2)
Device
Package
Pins
44
PLCC, Wire Bond
TQFP, Wire Bond
TQFP, Wire Bond
PLCC, Wire Bond
TQFP, Wire Bond
TQFP, Wire Bond
EPM3032A
44
44
EPM3064A
EPM3128A
44
100
100
Package Information Datasheet for Mature Altera Devices
© December 2011 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
