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CLK12P 参数 Datasheet PDF下载

CLK12P图片预览
型号: CLK12P
PDF下载: 下载PDF文件 查看货源
内容描述: 的Stratix II器件手册,卷1 [Stratix II Device Handbook, Volume 1]
分类和应用:
文件页数/大小: 768 页 / 5210 K
品牌: ALTERA [ ALTERA CORPORATION ]
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I/O Structure  
Differential On-Chip Termination  
Stratix II devices support internal differential termination with a nominal  
resistance value of 100 Ω for LVDS or HyperTransport technology input  
receiver buffers. LVPECL input signals (supported on clock pins only)  
require an external termination resistor. Differential on-chip termination  
is supported across the full range of supported differential data rates as  
shown in the DC & Switching Characteristics chapter in volume 1 of the  
Stratix II Device Handbook.  
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For more information on differential on-chip termination, refer to the  
High-Speed Differential I/O Interfaces with DPA in Stratix II & Stratix II GX  
Devices chapter in volume 2 of the Stratix II Device Handbook or the  
Stratix II GX Device Handbook.  
For more information on tolerance specifications for differential on-chip  
termination, refer to the DC & Switching Characteristics chapter in  
volume 1 of the Stratix II Device Handbook.  
On-Chip Series Termination Without Calibration  
Stratix II devices support driver impedance matching to provide the I/O  
driver with controlled output impedance that closely matches the  
impedance of the transmission line. As a result, reflections can be  
significantly reduced. Stratix II devices support on-chip series  
termination for single-ended I/O standards with typical RS values of 25  
and 50 Ω. Once matching impedance is selected, current drive strength is  
no longer selectable. Table 2–17 shows the list of output standards that  
support on-chip series termination without calibration.  
On-Chip Series Termination with Calibration  
Stratix II devices support on-chip series termination with calibration in  
column I/O pins in top and bottom banks. There is one calibration circuit  
for the top I/O banks and one circuit for the bottom I/O banks. Each  
on-chip series termination calibration circuit compares the total  
impedance of each I/O buffer to the external 25- or 50-Ω resistors  
connected to the RUPand RDNpins, and dynamically enables or disables  
the transistors until they match. Calibration occurs at the end of device  
configuration. Once the calibration circuit finds the correct impedance, it  
powers down and stops changing the characteristics of the drivers.  
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For more information on series on-chip termination supported by  
Stratix II devices, refer to the Selectable I/O Standards in Stratix II &  
Stratix II GX Devices chapter in volume 2 of the Stratix II Device Handbook  
or the Stratix II GX Device Handbook.  
2–92  
Stratix II Device Handbook, Volume 1  
Altera Corporation  
May 2007  
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