[AK4646]
PACKAGE (AK4646EZ)
32pin QFN (Unit: mm)
4.0 ± 0.1
2.4 ± 0.1
17
24
0.40 ± 0.10
16
25
32
A
Exposed
Pad
9
0.45 ± 0.10
8
1
B
C0.3
PIN #1 ID
0.18 ± 0.05
M
0.05
0.08
0.4
Note) The exposed pad on the bottom surface of the package must be open or connected to the ground.
Note that the maximum operating ambient temperature is 70°C when it is open.
■ Material & Lead finish
Package molding compound:
Lead frame material:
Epoxy
Cu
Lead frame surface treatment:
Solder (Pb free) plate
MS0557-E-05
2011/01
- 78 -