[AK4646]
PACKAGE (AK4646EN)
32pin QFN (Unit: mm)
5.00 ± 0.10
4.75 ± 0.10
0.40 ± 0.10
24
17
25
16
B
Exposed
Pad
32
9
32
1
C0.42
1
8
A
3.5
+0.07
0.23 -0.05
0.50
AB
M
0.10
C
C
0.08
Note) The exposed pad on the bottom surface of the package must be open or connected to the ground.
■ Material & Lead finish
Package molding compound:
Lead frame material:
Epoxy
Cu
Lead frame surface treatment:
Solder (Pb free) plate
MS0557-E-05
2011/01
- 77 -