Gull Wing Surface Mount Option #300
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
PAD LOCATION (FOR REFERENCE ONLY)
6.15
(0.242)TYP.
9.00 ± 0.15
(0.354 ± 0.006)
12.30 ± 0.30
(0.484 ± 0.012)
1
2
3
4
1.3
(0.051)
1.55
(0.061)
MAX.
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
0.9
(0.035)
4.00 MAX.
(0.158)
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
1.00 ± 0.15
(0.039 ± 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
7° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Regulatory Information
The HCNR200/201 optocoupler
features a 0.400" wide, eight pin
DIP package. This package was
specifically designed to meet
worldwide regulatory require-
ments. The HCNR200/201 has
been approved by the following
organizations:
UL
CSA
Recognized under UL
1577, Component
Recognition Program,
FILE E55361
Approved under CSA
Component Acceptance
Notice #5, File CA
88324
BSI
VDE
Certification according
to BS415:1994;
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class
II applications
Approved according to
VDE 0884/06.92
(Available Option #050
only)
1-420
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
