Data Sheet
June 1999
ORCA Series 3C and 3T FPGAs
Package Outline Diagrams (continued)
208-Pin SQFP2
Dimensions are in millimeters.
30.60 ± 0.20
28.00 ± 0.20
21.0 REF
PIN #1 IDENTIFIER ZONE
208
1.30 REF
157
156
0.25
GAGE PLANE
SEATING PLANE
0.50/0.75
21.0
REF
28.00
± 0.20
DETAIL A
30.60
± 0.20
0.090/0.200
0.17/0.2
105
M
0.10
DETAIL B
53
104
EXPOSED HEAT SINK APPEARS ON BOTTOM
SURFACE: CHIP BONDED FACE UP. (SEE DETAIL C.)
DETAIL A
DETAIL B
3.40 ± 0.20
4.10 MAX
SEATING PLANE
0.08
5-3828(F)
0.50 TYP
0.25 MIN
CHIP BONDED FACE UP
CHIP
COPPER HEAT SINK
DETAIL C (SQFP2 CHIP-UP)
5-3828(F).a
Lucent Technologies Inc.
199
AGERE [ AGERE SYSTEMS ]
