Data Sheet
June 1999
ORCA Series 3C and 3T FPGAs
Package Coplanarity
represent the contributions of all components of a
package, which include the bond wires, all internal
package routing, and the external leads.
The coplanarity limits of the ORCA Series 3 packages
are as follows.
Four inductances in nH are listed: LSW and LSL, the
self-inductance of the lead; and LMW and LML, the
mutual inductance to the nearest neighbor lead. These
parameters are important in determining ground
bounce noise and inductive crosstalk noise. Three
capacitances in pF are listed: CM, the mutual capaci-
tance of the lead to the nearest neighbor lead; and C1
and C2, the total capacitance of the lead to all other
leads (all other leads are assumed to be grounded).
These parameters are important in determining capaci-
tive crosstalk and the capacitive loading effect of the
lead. The lead resistance value, RW, is in MΩ.
Table 77. Package Coplanarity
Coplanarity Limit
Package Type
(mils)
EBGA
PBGA
8.0
8.0
SQFP/SQFP2
4.0
3.15
Package Parasitics
The parasitic values in Table 78 are for the circuit
model of bond wire and package lead parasitics. If the
mutual capacitance value is not used in the designer’s
model, then the value listed as mutual capacitance
should be added to each of the C1 and C2 capacitors.
The electrical performance of an IC package, such as
signal quality and noise sensitivity, is directly affected
by the package parasitics. Table 78 lists eight parasitics
associated with the ORCA packages. These parasitics
Table 78. Package Parasitics
Package Type
LSW
LMW
RW
C1
C2
CM
LSL
LML
208-Pin SQFP
208-Pin SQFP2
240-Pin SQFP
240-Pin SQFP2
256-Pin PBGA
352-Pin PBGA
432-Pin EBGA
600-Pin EBGA
4
4
4
4
5
5
4
4
2
2
200
200
200
200
220
220
500
500
1
1
1
1
1
1
7—10
6—9
4—6
4—6
2
1
1
1
8—12
7—11
5—8
5—8
2
1
1
1
4—7
2
1
1
1
2—4
2
1.5
1
1.5
1
1.5
0.3
0.4
7—12
3—5.5
3—6
3—6
1.5
1.5
0.5—1
0.5—1
1
1
LSW
RW
LSL
BOARD PAD
PAD N
C1
C2
LMW
LML
CM
PAD N + 1
LSW
RW
LSL
C1
C2
5-3862(F).a
Figure 104. Package Parasitics
196
Lucent Technologies Inc.